AS4C128M16D3A-12BCN

Basic Information Overview

• Category: Integrated Circuit (IC)
• Use: Memory module
• Characteristics:
  • High-speed operation
  • Low power consumption
  • Large storage capacity
• Package: BGA (Ball Grid Array)
• Essence: Dynamic Random Access Memory (DRAM)
• Packaging/Quantity: Tray, 250 units per tray

Specifications

• Part Number: AS4C128M16D3A-12BCN
• Organization: 128 Meg x 16
• Voltage: 1.35V
• Speed: 1600 MHz
• Operating Temperature Range: 0°C to +85°C
• Refresh: Auto-refresh and self-refresh modes
• Burst Length: 8
• CAS Latency: 12

Detailed Pin Configuration

The AS4C128M16D3A-12BCN has a total of 96 pins arranged in a specific configuration. The pinout diagram is as follows:

```

Pin Name Description

1 VDD Power Supply 2 VDDQ Power Supply for I/O Buffers 3 DQ0 Data Input/Output Bit 0 4 DQ1 Data Input/Output Bit 1 5 DQ2 Data Input/Output Bit 2 ... 96 VSS Ground ```

Functional Features

• High-speed operation allows for quick data access and transfer.
• Low power consumption helps in reducing energy usage.
• Large storage capacity enables storing a significant amount of data.
• Auto-refresh and self-refresh modes ensure data integrity during extended periods of inactivity.

Advantages and Disadvantages

Advantages

• Fast data access and transfer speeds.
• Energy-efficient design.
• Ample storage capacity for various applications.
• Reliable data integrity through auto-refresh and self-refresh modes.

Disadvantages

• Relatively higher cost compared to other memory modules.
• Requires proper cooling to prevent overheating during intensive usage.

Working Principles

The AS4C128M16D3A-12BCN is a dynamic random access memory (DRAM) module. It stores data in capacitors within its memory cells, which need to be periodically refreshed to maintain the stored information. The module operates by sending and receiving electrical signals through its pins, allowing for data read and write operations.

Detailed Application Field Plans

The AS4C128M16D3A-12BCN memory module finds application in various fields, including: 1. Personal Computers (PCs) 2. Laptops and Notebooks 3. Servers and Data Centers 4. Networking Equipment 5. Gaming Consoles 6. Embedded Systems

Detailed and Complete Alternative Models

1. AS4C256M16D3A-12BCN: 256 Meg x 16 DRAM module with similar specifications.
2. AS4C64M16D3A-12BCN: 64 Meg x 16 DRAM module with lower storage capacity.
3. AS4C512M16D3A-12BCN: 512 Meg x 16 DRAM module with higher storage capacity.

These alternative models provide options with varying storage capacities to suit different application requirements.

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