GD25LE128DLIGR

Product Overview

• Category: Flash Memory
• Use: Data storage and retrieval in electronic devices
• Characteristics: High capacity, fast read/write speeds, low power consumption
• Package: Integrated Circuit (IC)
• Essence: Non-volatile memory for long-term data storage
• Packaging/Quantity: Available in tape and reel packaging, quantity varies based on customer requirements

Specifications

• Memory Capacity: 128 Megabits (16 Megabytes)
• Interface: Serial Peripheral Interface (SPI)
• Operating Voltage: 2.7V - 3.6V
• Operating Temperature: -40°C to +85°C
• Data Retention: Up to 20 years
• Erase/Program Cycles: Up to 100,000 cycles

Detailed Pin Configuration

The GD25LE128DLIGR has a total of 8 pins:

1. VCC: Power supply input
2. GND: Ground connection
3. CS: Chip select for SPI communication
4. SCK: Serial clock for SPI communication
5. SI: Serial data input for SPI communication
6. SO: Serial data output for SPI communication
7. WP: Write protect pin for hardware protection
8. HOLD: Hold pin for suspending ongoing operations

Functional Features

• High-speed data transfer with SPI interface
• Sector-based erasing and programming
• Hardware write protection for enhanced security
• Low power consumption during standby and active modes
• Efficient error correction and detection mechanisms

Advantages and Disadvantages

Advantages: - Large storage capacity for extensive data storage needs - Fast read/write speeds for quick data access - Low power consumption for energy-efficient operation - Reliable data retention for long-term storage - Compact IC package for easy integration into electronic devices

Disadvantages: - Limited erase/program cycles may affect lifespan in intensive usage scenarios - Relatively higher cost compared to lower capacity flash memory options

Working Principles

The GD25LE128DLIGR utilizes the Serial Peripheral Interface (SPI) to communicate with the host device. It stores data in non-volatile memory cells, which retain information even when power is disconnected. The SPI interface allows for high-speed data transfer between the host and the flash memory. The memory is organized into sectors, enabling efficient erasing and programming of specific data segments.

Detailed Application Field Plans

The GD25LE128DLIGR is widely used in various electronic devices that require reliable and high-capacity data storage. Some common application fields include:

1. Consumer Electronics: Smartphones, tablets, digital cameras, portable media players
2. Automotive: Infotainment systems, navigation devices, instrument clusters
3. Industrial: Embedded systems, control units, data loggers
4. Networking: Routers, switches, network attached storage (NAS)
5. Medical: Patient monitoring devices, medical imaging equipment

Detailed and Complete Alternative Models

1. GD25Q128C: Similar flash memory with 128 Megabits capacity, but with Quad-SPI interface for faster data transfer.
2. MX25L12835F: Flash memory with 128 Megabits capacity, SPI interface, and extended temperature range (-40°C to +105°C).
3. W25Q128JVSIQ: High-performance flash memory with 128 Megabits capacity, Dual-SPI interface, and advanced security features.

These alternative models offer similar functionality and capacity, catering to different requirements and specifications.

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