EP4SE360H29I3

Product Overview

• Category: Integrated Circuit (IC)
• Use: Digital Signal Processing (DSP)
• Characteristics: High-performance, low-power consumption
• Package: BGA (Ball Grid Array)
• Essence: Advanced programmable logic device
• Packaging/Quantity: Single unit per package

Specifications

• Manufacturer: Intel Corporation
• Technology: 40nm
• Logic Elements: 360,000
• Embedded Memory: 29,000 Kbits
• I/O Pins: 3,300
• Clock Management: PLLs and DLLs
• Operating Voltage: 1.2V
• Operating Temperature: -40°C to 100°C
• Package Dimensions: 29mm x 29mm

Detailed Pin Configuration

The EP4SE360H29I3 has a complex pin configuration with multiple pins serving different functions. The detailed pin configuration can be found in the manufacturer's datasheet.

Functional Features

• High-speed digital signal processing capabilities
• Flexible and reprogrammable design
• Low power consumption
• Support for various communication protocols
• On-chip memory for efficient data storage
• Built-in clock management circuitry

Advantages

• Versatile and adaptable for a wide range of applications
• High-performance computing capabilities
• Reduced power consumption compared to alternative models
• Compact size and high integration level
• Reliable and durable design

Disadvantages

• Higher cost compared to lower-end alternatives
• Steeper learning curve for programming and utilization
• Limited availability of technical support for complex issues

Working Principles

The EP4SE360H29I3 is based on Field-Programmable Gate Array (FPGA) technology. It consists of a large number of configurable logic blocks interconnected through programmable routing resources. These logic blocks can be programmed to perform various digital signal processing tasks, making the device highly flexible and adaptable.

Detailed Application Field Plans

The EP4SE360H29I3 finds applications in a wide range of fields, including:

1. Telecommunications: Signal processing in wireless communication systems.
2. Industrial Automation: Control systems for manufacturing processes.
3. Aerospace: Onboard data processing and control systems.
4. Medical Imaging: Real-time image processing in medical devices.
5. High-Performance Computing: Acceleration of complex algorithms.

Detailed and Complete Alternative Models

1. EP4SGX230KF40C2N: Similar FPGA with higher logic elements and memory capacity.
2. EP4CE115F29C7N: Lower-cost alternative with reduced logic elements and I/O pins.
3. EP4CE30F23C8N: Compact FPGA with lower power consumption and moderate performance.

Note: For a comprehensive list of alternative models, refer to the manufacturer's product catalog.

This entry provides an overview of the EP4SE360H29I3, including its product category, use, characteristics, package, specifications, pin configuration, functional features, advantages and disadvantages, working principles, detailed application field plans, and alternative models.