IS46DR16128C-3DBLA1

Basic Information Overview

• Category: Integrated Circuit (IC)
• Use: Memory module
• Characteristics: High-speed, high-density, low-power
• Package: BGA (Ball Grid Array)
• Essence: Dynamic Random Access Memory (DRAM)
• Packaging/Quantity: Single unit

Specifications

• Capacity: 16 gigabits (2 gigabytes)
• Organization: 128M x 16 bits
• Voltage Supply: 1.2V
• Speed: DDR4-3200
• Operating Temperature Range: -40°C to +85°C

Detailed Pin Configuration

The IS46DR16128C-3DBLA1 has a total of 96 pins arranged in a specific configuration. The pinout diagram is as follows:

Pin Name Function 1 VSS Ground 2 DQ0 Data Input/Output Bit 0 3 DQ1 Data Input/Output Bit 1 4 DQ2 Data Input/Output Bit 2 5 DQ3 Data Input/Output Bit 3 ... 96 VDD Power Supply

Functional Features

• High-speed operation: The IS46DR16128C-3DBLA1 offers fast data transfer rates, making it suitable for applications that require quick access to large amounts of data.
• High-density storage: With a capacity of 16 gigabits, this memory module can store a significant amount of information in a compact form factor.
• Low-power consumption: The IC is designed to operate efficiently with low power requirements, contributing to energy savings and longer battery life in portable devices.

Advantages and Disadvantages

Advantages: - Fast data transfer rates enable efficient processing of large datasets. - High-density storage allows for the storage of vast amounts of information. - Low-power consumption contributes to energy efficiency.

Disadvantages: - The BGA package may require specialized equipment for installation and replacement. - Limited compatibility with older memory module standards may restrict its use in certain systems.

Working Principles

The IS46DR16128C-3DBLA1 is based on the dynamic random access memory (DRAM) technology. It stores data in capacitors within an array of memory cells, which are organized into rows and columns. To read or write data, the IC applies voltage to specific rows and columns, allowing the charge stored in the capacitors to be sensed or modified.

Detailed Application Field Plans

The IS46DR16128C-3DBLA1 is commonly used in various electronic devices and systems that require high-speed and high-density memory, such as: - Personal computers - Servers - Gaming consoles - Networking equipment - Mobile devices

Detailed and Complete Alternative Models

• IS46DR32160D-3DBLA1: 32 gigabit (4 gigabyte) capacity, 256M x 16 bits organization, DDR4-3200 speed.
• IS46DR08160D-3DBLA1: 8 gigabit (1 gigabyte) capacity, 64M x 16 bits organization, DDR4-3200 speed.
• IS46DR64160D-3DBLA1: 64 gigabit (8 gigabyte) capacity, 512M x 16 bits organization, DDR4-3200 speed.

These alternative models offer different capacities and organizations while maintaining similar characteristics and specifications to the IS46DR16128C-3DBLA1.

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