Vishay Siliconix
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IRFR214TRRPBF
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IRFR214TRRPBF

Product Overview

Category

IRFR214TRRPBF belongs to the category of power MOSFETs.

Use

It is commonly used in various electronic circuits and applications where high power switching is required.

Characteristics

  • High voltage capability
  • Low on-resistance
  • Fast switching speed
  • Low gate charge

Package

The IRFR214TRRPBF is typically available in a TO-252 package.

Essence

This MOSFET is essential for controlling high-power loads in electronic devices.

Packaging/Quantity

It is usually packaged in reels with a quantity of 2500 units per reel.

Specifications

  • Drain-Source Voltage (VDS): 250V
  • Continuous Drain Current (ID): 2.7A
  • RDS(ON) (Max) @ VGS = 10V: 1.5 Ohm
  • Gate-Source Voltage (VGS): ±20V
  • Power Dissipation (PD): 2.0W

Detailed Pin Configuration

The IRFR214TRRPBF has three pins: 1. Gate (G) 2. Drain (D) 3. Source (S)

Functional Features

  • High voltage capability allows it to handle large power loads.
  • Low on-resistance minimizes power loss and heat generation.
  • Fast switching speed enables efficient control of power flow.

Advantages

  • Suitable for high voltage applications
  • Low power dissipation
  • Fast switching speed

Disadvantages

  • Limited continuous drain current compared to some other MOSFETs
  • Higher on-resistance than certain alternative models

Working Principles

The IRFR214TRRPBF operates based on the principle of field-effect transistors, where the voltage applied to the gate terminal controls the flow of current between the drain and source terminals.

Detailed Application Field Plans

This MOSFET is widely used in: - Switching power supplies - Motor control circuits - LED lighting systems - Audio amplifiers

Detailed and Complete Alternative Models

Some alternative models to IRFR214TRRPBF include: - IRFZ44N - IRF3205 - IRFP460

In conclusion, the IRFR214TRRPBF is a versatile power MOSFET with high voltage capability, low on-resistance, and fast switching speed, making it suitable for various high-power electronic applications.

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قم بإدراج 10 أسئلة وإجابات شائعة تتعلق بتطبيق IRFR214TRRPBF في الحلول التقنية

  1. What is the IRFR214TRRPBF used for?

    • The IRFR214TRRPBF is a power MOSFET designed for various applications such as switch mode power supplies, motor control, and DC-DC converters.

  2. What is the maximum drain-source voltage of the IRFR214TRRPBF?

    • The maximum drain-source voltage of the IRFR214TRRPBF is 250V.

  3. What is the maximum continuous drain current of the IRFR214TRRPBF?

    • The maximum continuous drain current of the IRFR214TRRPBF is 4.3A.

  4. What is the on-state resistance (RDS(on)) of the IRFR214TRRPBF?

    • The on-state resistance (RDS(on)) of the IRFR214TRRPBF is typically 0.55 ohms.

  5. Can the IRFR214TRRPBF be used in automotive applications?

    • Yes, the IRFR214TRRPBF is suitable for automotive applications due to its high voltage and current ratings.

  6. What are the typical thermal characteristics of the IRFR214TRRPBF?

    • The IRFR214TRRPBF has a low thermal resistance and is designed to operate within a wide temperature range, making it suitable for demanding thermal environments.

  7. Does the IRFR214TRRPBF have built-in protection features?

    • The IRFR214TRRPBF is designed with robust construction and can handle overcurrent and overvoltage conditions, providing a level of inherent protection.

  8. Can the IRFR214TRRPBF be used in high-frequency switching applications?

    • Yes, the IRFR214TRRPBF is suitable for high-frequency switching due to its fast switching characteristics and low gate charge.

  9. What are the recommended mounting and soldering techniques for the IRFR214TRRPBF?

    • The IRFR214TRRPBF should be mounted on a suitable heat sink and soldered using industry-standard reflow or wave soldering techniques to ensure proper thermal and electrical performance.

  10. Are there any common failure modes associated with the IRFR214TRRPBF?

    • Common failure modes include excessive thermal stress, overvoltage spikes, and improper handling during assembly. Proper design considerations and application guidelines can mitigate these risks.