XC6VLX130T-3FFG1156C

Product Overview

Category

The XC6VLX130T-3FFG1156C belongs to the category of Field-Programmable Gate Arrays (FPGAs).

Use

FPGAs are integrated circuits that can be programmed and reprogrammed to perform various digital functions. They are widely used in industries such as telecommunications, automotive, aerospace, and consumer electronics.

Characteristics

The XC6VLX130T-3FFG1156C is known for its high-performance capabilities, offering a balance between power consumption and processing speed. It provides a flexible and customizable solution for complex digital designs.

Package

The XC6VLX130T-3FFG1156C comes in a Flip-Chip Fine-Pitch Ball Grid Array (FFG) package.

Essence

The essence of the XC6VLX130T-3FFG1156C lies in its ability to implement complex digital logic functions through programmable interconnects and configurable logic blocks.

Packaging/Quantity

The XC6VLX130T-3FFG1156C is typically packaged individually and is available in varying quantities depending on the manufacturer's specifications.

Specifications

The XC6VLX130T-3FFG1156C has the following specifications:

• Logic Cells: 131,200
• Block RAM: 4,860 Kb
• DSP Slices: 864
• Maximum Frequency: 550 MHz
• I/O Pins: 1,156
• Operating Voltage: 1.0V - 1.2V
• Operating Temperature: -40°C to 100°C

Detailed Pin Configuration

The XC6VLX130T-3FFG1156C has a complex pin configuration with multiple input/output pins. For a detailed pin configuration diagram, please refer to the manufacturer's datasheet.

Functional Features

The XC6VLX130T-3FFG1156C offers several functional features, including:

1. High-performance processing capabilities
2. Configurable logic blocks for flexible design implementation
3. Programmable interconnects for custom routing
4. On-chip memory resources for data storage
5. Dedicated Digital Signal Processing (DSP) slices for efficient signal processing
6. Support for various communication protocols and interfaces

Advantages and Disadvantages

Advantages

• High processing performance
• Flexibility in design implementation
• Customizable interconnects
• On-chip memory resources
• DSP slices for efficient signal processing

Disadvantages

• Higher power consumption compared to other alternatives
• Steeper learning curve for programming and design implementation

Working Principles

The XC6VLX130T-3FFG1156C operates based on the principles of reconfigurable computing. It consists of configurable logic blocks interconnected through programmable interconnects. The device can be programmed using Hardware Description Languages (HDLs) such as VHDL or Verilog to implement desired digital functions.

Detailed Application Field Plans

The XC6VLX130T-3FFG1156C finds applications in various fields, including:

1. Telecommunications: Used in base stations, routers, and network switches for high-speed data processing.
2. Automotive: Employed in advanced driver-assistance systems (ADAS), infotainment systems, and engine control units (ECUs).
3. Aerospace: Utilized in satellite communication systems, avionics, and radar systems.
4. Consumer Electronics: Integrated into high-definition televisions, gaming consoles, and multimedia devices.

Detailed and Complete Alternative Models

1. XC7A100T-1FGG484C: A newer model with improved performance and lower power consumption.
2. XC6SLX150-3FGG484C: Offers higher logic capacity and additional features for more complex designs.
3. XC7Z020-1CLG400C: Combines FPGA and ARM processor for embedded system applications.

These alternative models provide a range of options with varying capabilities to suit different design requirements.

In conclusion, the XC6VLX130T-3FFG1156C is a high-performance FPGA that offers flexibility and customization in digital design implementation. Its functional features, advantages, and application field plans make it suitable for a wide range of industries. However, it is important to consider its power consumption and programming complexity when choosing this FPGA for a specific project.