XC7Z045-L2FBG676I

Product Overview

Category

XC7Z045-L2FBG676I belongs to the category of programmable System-on-Chip (SoC) devices.

Use

This product is primarily used in embedded systems and applications that require high-performance processing capabilities.

Characteristics

• Programmable SoC with integrated processing system and programmable logic
• High-performance ARM Cortex-A9 processor cores
• FPGA fabric for customizable hardware acceleration
• On-chip memory and peripherals for system integration
• Advanced connectivity options for seamless communication

Package

XC7Z045-L2FBG676I is available in a FBG676 package, which refers to a fine-pitch ball grid array (BGA) package with 676 solder balls.

Essence

The essence of XC7Z045-L2FBG676I lies in its ability to combine the flexibility of programmable logic with the processing power of an ARM-based processor. This integration enables developers to create highly optimized and customized solutions for a wide range of applications.

Packaging/Quantity

XC7Z045-L2FBG676I is typically sold individually or in small quantities, depending on the supplier and customer requirements.

Specifications

• FPGA Logic Cells: 444,000
• Block RAM: 2,900 KB
• DSP Slices: 3,600
• ARM Processor Cores: Dual-core ARM Cortex-A9
• Clock Frequency: Up to 1 GHz
• Operating Voltage: 0.95V - 1.05V
• I/O Voltage: 1.8V - 3.3V
• Maximum Power Consumption: 5W

Detailed Pin Configuration

For a detailed pin configuration of XC7Z045-L2FBG676I, please refer to the manufacturer's datasheet or documentation.

Functional Features

XC7Z045-L2FBG676I offers the following functional features:

• High-performance processing: The dual-core ARM Cortex-A9 processor cores provide efficient and powerful processing capabilities.
• Programmable logic: The FPGA fabric allows for hardware customization and acceleration, enabling developers to optimize performance for specific tasks.
• On-chip memory and peripherals: Integrated memory and peripherals simplify system integration and reduce external component requirements.
• Advanced connectivity: XC7Z045-L2FBG676I supports various communication interfaces, including Ethernet, USB, PCIe, and more.

Advantages and Disadvantages

Advantages

• Flexibility: The programmable nature of XC7Z045-L2FBG676I allows for customization and adaptation to specific application requirements.
• High-performance: The combination of ARM processors and FPGA fabric enables efficient and powerful processing capabilities.
• Integration: On-chip memory and peripherals simplify system design and reduce external component count.

Disadvantages

• Complexity: Utilizing the full potential of XC7Z045-L2FBG676I requires expertise in both software and hardware development.
• Cost: Programmable SoCs tend to be more expensive compared to traditional microcontrollers or processors.

Working Principles

XC7Z045-L2FBG676I operates based on the principles of a programmable System-on-Chip. The ARM Cortex-A9 processor cores handle general-purpose computing tasks, while the FPGA fabric provides customizable hardware acceleration. The processor and FPGA communicate through a high-speed interconnect, allowing for seamless data transfer and collaboration between the two components.

Detailed Application Field Plans

XC7Z045-L2FBG676I finds applications in various fields, including but not limited to:

1. Industrial Automation: Used for real-time control systems, machine vision, and robotics.
2. Communications: Enables high-speed data processing and networking in telecommunications equipment.
3. Aerospace and Defense: Utilized in radar systems, avionics, and secure communication devices.
4. Medical Devices: Provides processing power for medical imaging, patient monitoring, and diagnostics.
5. Automotive: Supports advanced driver assistance systems (ADAS), infotainment, and vehicle networking.

Detailed and Complete Alternative Models

Some alternative models to XC7Z045-L2FBG676I that offer similar capabilities are:

1. XC7Z030-L2FBG676I
2. XC7Z100-L2FBG676I
3. XC7Z020-L2FBG676I

These models differ in terms of FPGA resources, processor cores, and other specifications. It is recommended to consult the manufacturer's documentation for detailed comparisons and selection based on specific project requirements.

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