XCV200-4FG256I

Product Overview

Category: Integrated Circuit (IC)

Use: The XCV200-4FG256I is a programmable logic device (PLD) used for digital circuit design and implementation. It offers high flexibility and customization options, making it suitable for a wide range of applications.

Characteristics: - Programmable logic device - High flexibility and customization options - Versatile application possibilities - Compact package size - Efficient power consumption

Package: The XCV200-4FG256I comes in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package. This compact package ensures efficient use of space on printed circuit boards (PCBs).

Essence: The XCV200-4FG256I is designed to provide a flexible and customizable solution for digital circuit design. It allows users to implement complex logic functions and control systems efficiently.

Packaging/Quantity: The XCV200-4FG256I is typically sold individually or in small quantities, depending on the requirements of the user or project.

Specifications

• Logic Cells: 200,000
• Flip-Flops: 4,000
• Maximum Frequency: 250 MHz
• I/O Pins: 256
• Operating Voltage: 1.8V - 3.3V
• Package Type: FBGA
• Package Pins: 256
• Temperature Range: -40°C to +85°C

Detailed Pin Configuration

The XCV200-4FG256I has a total of 256 pins. These pins are divided into different categories, including input/output pins, power supply pins, configuration pins, and ground pins. The detailed pin configuration can be found in the product datasheet provided by the manufacturer.

Functional Features

• High logic capacity for complex designs
• Flexible and customizable programming options
• Efficient power consumption for energy-efficient operation
• Fast operating speed for real-time applications
• Wide temperature range for versatile deployment

Advantages and Disadvantages

Advantages: - High flexibility and customization options - Versatile application possibilities - Compact package size - Efficient power consumption - Fast operating speed

Disadvantages: - Limited logic capacity compared to higher-end models - Higher cost compared to simpler programmable logic devices

Working Principles

The XCV200-4FG256I is based on Field-Programmable Gate Array (FPGA) technology. It consists of a matrix of configurable logic blocks interconnected through programmable interconnects. Users can program the device to implement desired logic functions and control systems by configuring the interconnections between logic blocks.

Detailed Application Field Plans

The XCV200-4FG256I finds applications in various fields, including but not limited to: 1. Digital signal processing 2. Embedded systems 3. Communication systems 4. Industrial automation 5. Robotics 6. Automotive electronics 7. Aerospace and defense

Its versatility and customizable nature make it suitable for a wide range of applications that require complex digital circuit design and implementation.

Detailed and Complete Alternative Models

1. XCV200-4BG256I: Similar to XCV200-4FG256I, but with a different package type (BGA).
2. XCV300-6FG456I: Higher-end model with increased logic capacity and more I/O pins.
3. XCV1000-8FG680I: Advanced model with even higher logic capacity and enhanced features.
4. XCV500-10FG900I: Top-of-the-line model with maximum logic capacity and extensive I/O capabilities.

These alternative models offer varying levels of performance and features, allowing users to choose the most suitable option based on their specific requirements.

Note: The above information is based on the available data at the time of writing and may be subject to change. It is recommended to refer to the manufacturer's datasheet for the most up-to-date and accurate information.